Xpedition Substrate Integrator: IC package prototyping trial

Xpedition Substrate Integrator trial

Start your free, thirty-day IC package prototyping trial in just minutes

Why Xpedition Substrate Integrator?

  • Rapidly integrate die/chiplets, interposers and packages from different processes and suppliers

  • Define and optimize connectivity in context of full system – die, interposer, package and pcb

  • Generate and manage the full system assembly net list

  • Eliminate your dependency on error-prone spreadsheets

  • Explore how rapid prototyping drives early predictive electrical and thermal analysis

Screenshot of Xpedition Substrate Integrator software

Trial Details

Trial features

  • Fully licensed software with sample files and guided tutorials

  • No massive downloads or lengthy installations

  • Ready to go! Instant access anytime, anywhere

Trial requirements

  • This complimentary trial is only available for qualified businesses, not members of the press or competition

  • Sign up with a valid email address, LinkedIn profile or Google account

  • Select your country/region