Explore advanced IC Package substrate design with Xpedition Package Designer

Advanced IC package design trial

Start your free, 30-day IC Package design trial in just minutes

Why Xpedition Package designer?

  • Fastest path to implement large, complex packages and interposers.

  • Advanced support for 2.5D/3D heterogeneous designs

  • Minimizes substrate re-spins and material scrap cost with tape-out ready metal fill

  • Productivity, capacity and performance for ultra-high pin count designs

SIP chip

Try this free Xpedition Package Designer lab. No installation required, start designing in minutes.

Trial Details

Trial features

  • Fully licensed software with sample files and guided tutorials

  • No massive downloads or lengthy installations

  • Ready to go! Instant access anytime, anywhere

Trial requirements

  • This complimentary trial is only available for qualified businesses, not members of the press or competition

  • Sign up with a valid email address, LinkedIn profile or Google account

  • Select your country/region