Using an ECO virtual die design flow trial
Why use virtual die with library exchange format (LEF)/design exchange format (DEF)?
Create virtual die using LEF/DEF for early package floorplanning
Use LEF/DEF for engineering change order (ECO) changes with the chiplet place and route (P&R) team
No installation required – we handle the environment for you. Try xSI for virtual die creation today! (Chrome/Firefox/Edge/Safari recommended)
Import LEF/DEF data from chip designers to begin early package floorplanning.
Robust LEF/DEF ECO flow provides die changes back to chip designers.
Using virtual die enables early package floorplanning and co-design with chip designers.
Fully licensed software with sample files and guided tutorials
No massive downloads or lengthy installations
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This complimentary trial is only available for qualified businesses, not members of the press or competition
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