Building a virtual semiconductor die using LEF/DEF

Using an ECO virtual die design flow trial

Creating IC package virtual die with LEF/DEF

Why use virtual die with library exchange format (LEF)/design exchange format (DEF)?

  • Create virtual die using LEF/DEF for early package floorplanning

  • Use LEF/DEF for engineering change order (ECO) changes with the chiplet place and route (P&R) team


No installation required – we handle the environment for you. Try xSI for virtual die creation today! (Chrome/Firefox/Edge/Safari recommended)

Use LEF/DEF to create a virtual die

Import LEF/DEF data from chip designers to begin early package floorplanning.

ECO flow for virtual die changes

Robust LEF/DEF ECO flow provides die changes back to chip designers.

Virtual die supports package prototyping

Using virtual die enables early package floorplanning and co-design with chip designers.

Trial Details

Trial features

  • Fully licensed software with sample files and guided tutorials

  • No massive downloads or lengthy installations

  • Ready to go! Instant access anytime, anywhere

Trial requirements

  • This complimentary trial is only available for qualified businesses, not members of the press or competition

  • Sign up with a valid email address, LinkedIn profile or Google account

  • Select your country/region