Semiconductor bump planning of die and chiplets during package floorplanning
Semiconductor die bump planning process flow trial
Die/chiplet bump planning
Learn how to quickly create die/chiplet bump plans with signal assignments.
No installation required – we handle the environment for you. Try xSI and xPD today! (Chrome/Firefox/Edge/Safari recommended)
Trial Details
Rapid creation of die/chiplet bump arrays
Fast creation of floorplan bump arrays and associated signal assignments without the need for spreadsheets.
Smart copy and paste of signals to bumps
Copy a set of signals and/or nets from one location and paste with programmable increment patterns to multiple targets.
Smart signal-based color propagation
Quickly establish common signal colors across multiple device bump arrays based on signal names.
Trial Details
Trial features
Fully licensed software with sample files and guided tutorials
No massive downloads or lengthy installations
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Trial requirements
This complimentary trial is only available for qualified businesses, not members of the press or competition
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