Semiconductor die bump planning process flow trial
Learn how to quickly create die/chiplet bump plans with signal assignments.
No installation required – we handle the environment for you. Try xSI and xPD today! (Chrome/Firefox/Edge/Safari recommended)
Fast creation of floorplan bump arrays and associated signal assignments without the need for spreadsheets.
Copy a set of signals and/or nets from one location and paste with programmable increment patterns to multiple targets.
Quickly establish common signal colors across multiple device bump arrays based on signal names.
Fully licensed software with sample files and guided tutorials
No massive downloads or lengthy installations
Ready to go! Instant access anytime, anywhere
This complimentary trial is only available for qualified businesses, not members of the press or competition
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